search for books and compare prices
Chwee Teck Lim has written 2 work(s)
Search for other authors with the same name
displaying 1 to 2 | at end
show results in order: alphabetically | oldest to newest | newest to oldest
Cover for 9781605112510 Cover for 9781107406742 Cover for 9780138346492 Cover for 9783540928409
Biological Materials and Structures in Physiologically Extreme Conditions and Disease
cover image for 9781107406742
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
By Markus J. Buehler (editor), David Kaplan (editor), Chwee Teck Lim (editor) and Joachim Spatz (editor)
See complete details on each edition (2 editions listed)

Hardcover:

9781605112510 | Materials Research Society, December 31, 2010, cover price $124.99 | About this edition: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Paperback:

9781107406742 | Cambridge Univ Pr, June 5, 2014, cover price $35.00

ICBME2008 - 13th International Conference on Biomedical Engineering, 3 - 6 December 2008, Singapore
cover image for 9783540928409
Product Description: th On behalf of the organizing committee of the 13 International Conference on Biomedical Engineering, I extend our w- mest welcome to you. This series of conference began in 1983 and is jointly organized by the YLL School of Medicine and Faculty of Engineering of the National University of Singapore and the Biomedical Engineering Society (Singapore)...read more
By James C. H. Goh (editor) and Chwee Teck Lim (editor)
See complete details on each edition (2 editions listed)

Hardcover:

9780138346492, titled "Spice: A Guide to Circuit Simulation and Analysis Using Spice" | Prentice Hall, September 1, 1988, cover price $11.75 | also contains Spice: A Guide to Circuit Simulation and Analysis Using Spice

Paperback:

9783540928409 | 1 edition (Springer Verlag, August 30, 2009), cover price $669.00 | About this edition: th On behalf of the organizing committee of the 13 International Conference on Biomedical Engineering, I extend our w- mest welcome to you.

displaying 1 to 2 | at end