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Axel Jantsch has written 6 work(s)
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Product Description: As Mooreâs law continues to unfold, two important trends have recently emerged. First, the growth of chip capacity is translated into a corresponding increase of number of cores. Second, the parallelization of the computation and 3D integration technologies lead to distributed memory architectures...read more
Hardcover:
9781441967770 | Springer Verlag, October 15, 2011, cover price $119.00
Paperback:
9781489993151 | Springer Verlag, November 24, 2014, cover price $119.00 | About this edition: As Mooreâs law continues to unfold, two important trends have recently emerged.
Paperback:
9781461427483 | Springer Verlag, January 2, 2013, cover price $179.00
Hardcover:
9780123746450 | Cdr edition (Morgan Kaufmann Pub, July 22, 2008), cover price $240.00
In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.
Hardcover:
9781402078354 | Kluwer Academic Pub, August 1, 2004, cover price $249.00
Paperback:
9781441954428 | Springer Verlag, August 1, 2004, cover price $249.00 | About this edition: In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design.
Product Description: As the number of processor cores and IP blocks integrated on a single chip is steadily growing, a systematic approach to design the communication infrastructure becomes necessary. Different variants of packed switched on-chip networks have been proposed by several groups during the past two years...read more
Hardcover:
9781402073922 | Kluwer Academic Pub, February 1, 2003, cover price $189.00 | About this edition: As the number of processor cores and IP blocks integrated on a single chip is steadily growing, a systematic approach to design the communication infrastructure becomes necessary.
Paperback:
9781441953445 | Springer Verlag, February 1, 2003, cover price $189.00 | About this edition: As the number of processor cores and IP blocks integrated on a single chip is steadily growing, a systematic approach to design the communication infrastructure becomes necessary.
Product Description: Over the last decade, advances in the semiconductor fabrication process have led to the realization of true system-on-a-chip devices. But the theories, methods and tools for designing, integrating and verifying these complex systems have not kept pace with our ability to build them...read more
Hardcover:
9781558609259 | Morgan Kaufmann Pub, June 3, 2003, cover price $86.95 | About this edition: Over the last decade, advances in the semiconductor fabrication process have led to the realization of true system-on-a-chip devices.
Miscellaneous:
9780080511825 | Morgan Kaufmann Pub, June 26, 1905, cover price $66.95
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