search for books and compare prices
Tables of Contents for Silicon Processing for the Vlsi Era
Chapter/Section Title
Page #
Page Count
Preface
The Evolution of the Structure of Mosfets
1
16
300-MM Silicon Wafers
17
58
Gate Dielectrics: Thin Gate Oxides
75
70
High-k Dielectrics
145
36
The Structure of Deep-Submicron Mosfets: Retrograde-Wells; Super-Steep Retrograde Channel Doping; Drain Engineering; Punchthrough-Control Implants
181
46
Deep-Submicron Lithography I: Photoresists
227
32
Deep-Submicron Lithography II: Optics and Hardware
259
54
Chemical Mechanical Polishing (CMP)
313
120
Shallow Trench Isolation (STI)
433
42
Silicon-Germanium (Si-Ge) Technology for High-Performance Telecommunications ICs
475
26
Silicon-On-Insulator (SOI) Technology
501
72
Multilevel Interconnects for Ulsi
573
30
Polycides and Salicides of TISi2, CoSi2 and NiSi
603
36
Low-k Dielectrics
639
32
Dual-Damascene Interconnects
671
40
Copper Interconnect Process Technology
711
84
Index
795