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Tables of Contents for Surface Mount Technology
Chapter/Section Title
Page #
Page Count
Dedication
v
15
Foreword
xx
3
Preface
xxiii
3
Acknowledgments
xxvi
2
About the Author
xxviii
Part One Introduction to Surface Mounting
3
82
Chapter 1 Introduction to Surface Mount Technology
3
48
1.0 Introduction
3
4
1.1 Types of Surface Mounting
7
7
1.2 Benefits of Surface Mounting
14
6
1.3 SMT Equipment Requiring Major Capital Investment
20
7
1.3.1 Pick-and-Place Equipment
22
1
1.3.2 Solder Paste Screen Printer
23
1
1.3.3 Curing/Baking Oven
23
1
1.3.4 Reflow Soldering Equipment
24
1
1.3.5 Cleaning
25
1
1.3.6 Wave Soldering Equipment
25
1
1.3.7 Repair and Inspection Equipment
26
1
1.4 When to Use Surface Mounting
27
1
1.5 Technical Issues in Surface Mounting
28
3
1.6 Trends in Surface Mounting
31
2
1.7 The Future
33
16
1.7.1 Chip-and-Wire Technology
36
2
1.7.2 Tape-Automated Bonding (TAB)
38
3
1.7.3 Flip Chip or Controlled Collapse Bonding
41
6
1.7.4 Multichip Module
47
2
1.8 Summary
49
1
References
50
1
Chapter 2 Implementing SMT In-House and at Subcontractors
51
34
2.0 Introduction
51
1
2.1 Setting the Implementation Strategy
52
3
2.2 Building the SMT Infrastructure
55
8
2.2.1 Developing the Internal SMT Infrastructure
56
4
2.2.1.1 Writing the Plan
56
1
2.2.1.2 Management Review
56
1
2.2.1.3 Hands-On Experience
57
1
2.2.1.4 Process Selection
58
1
2.2.1.5 Training
59
1
2.2.2 Influencing External SMT Infrastructure
60
3
2.3 Setting In-House Manufacturing Strategy
63
1
2.4 Selection of an Outside Assembly House
64
14
2.4.1 Reasons for Not Using Suppliers
64
1
2.4.2 Reasons for Using Suppliers
65
2
2.4.3 Evaluation and Qualification of Suppliers
67
1
2.4.4 Stages of Supplier Qualification
67
2
2.4.4.1 Preliminary Survey
68
1
2.4.4.2 Evaluation Status
68
1
2.4.4.3 Conditional Qualification Status
68
1
2.4.4.4 Approved Qualification Status
69
1
2.4.5 Supplier Rating
69
1
2.4.6 Questionnaires for Rating of Suppliers
70
6
2.4.6.1 Business Questions
71
1
2.4.6.2 Technology Questions
72
2
2.4.6.3 Manufacturing Questions
74
1
2.4.6.4 Quality Assurance Questions
75
1
2.4.7 Supplier Management or Partnership
76
2
2.5 Managing the Risk: Pilot to Production
78
2
2.6 Summary
80
5
Part Two Designing with Surface Mounting
85
254
Chapter 3 Surface Mount Components
85
64
3.0 Introduction
85
1
3.1 Surface Mount Component Characteristics
86
1
3.2 Passive Surface Mount Components
87
16
3.2.1 Surface Mount Discrete Resistors
88
3
3.2.2 Surface Mount Resistor Networks
91
1
3.2.3 Ceramic Capacitors
92
5
3.2.4 Tantalum Capacitors
97
4
3.2.5 Tubular Passive Components
101
2
3.3 Active Components: Ceramic Packages
103
6
3.3.1 Leadless Ceramic Chip Carriers
104
4
3.3.2 Ceramic Leaded Chip Carriers (Preleaded and Postleaded)
108
1
3.4 Active Components: Plastic Packages
109
20
3.4.1 Small Outline Transistors
112
2
3.4.2 Small Outline Integrated Circuits (SOICs and SOPs)
114
7
3.4.3 Plastic Leaded Chip Carriers
121
3
3.4.4 Small Outline J Packages
124
2
3.4.5 Fine Pitch Packages
126
3
3.5 Ball Grid Arrays (BGAs)
129
7
3.5.1 Ceramic Ball Grid Array (CBGA)
131
1
3.5.2 Ceramic Column Grid Array (CCGA)
132
1
3.5.3 Plastic Ball Grid Array (PBGA)
133
2
3.5.4 Tape Ball Grid Array (TBGA)
135
1
3.6 Chip Scale Packaging
136
2
3.7 Major Issues in Components
138
6
3.7.1 Lead Coplanarity
138
2
3.7.2 Lead Configuration
140
4
3.7.2.1 Gull Wing
140
1
3.7.2.2 Balls (in BGA)
141
1
3.7.2.3 J Lead
142
1
3.7.2.4 Butt or I Lead
142
2
3.7.3 Standardization
144
1
3.8 Component Procurement Guidelines
144
2
3.9 Summary
146
1
References
147
2
Chapter 4 Substrates for Surface Mounting
149
55
4.0 Introduction
149
1
4.1 Glass Transition Temperature (T(g))
150
2
4.2 X, Y, and Z Coefficients of Thermal Expansion
152
3
4.3 Selection of Substrate Material
155
12
4.3.1 CTE Compatibility Considerations in Substrate Selection
163
2
4.3.2 Process Considerations in Substrate Selection
165
2
4.4 Ceramic Substrates
167
2
4.4.1 Porcelainized Steel Substrates
168
1
4.5 Constraining Core Substrates
169
4
4.5.1 Low CTE Metal Core Substrate
169
4
4.5.2 Graphite Epoxy Constraining Core Substrates
172
1
4.6 Compliant Layer Substrates
173
1
4.7 Glass Epoxy Substrates
174
10
4.7.1 Types of Glass Epoxy Substrate
176
2
4.7.2 Operating Temperatures for Glass Epoxy Boards
178
1
4.7.3 Fabrication of Glass Epoxy Substrates
178
6
4.8 Plating Processes
184
7
4.8.1 Copper Plating
186
3
4.8.2 Gold Plating
189
1
4.8.3 Nickel Plating
189
1
4.8.4 Lead-Tin Solder Plating
189
2
4.9 Alternative Coatings for Board Surfaces
191
3
4.10 Solder Mask Selection
194
4
4.10.1 Wet versus Dry Film Solder Masks
195
2
4.10.2 Photoimageable Solder Masks
197
1
4.11 Via Hole Cracking Problems in Substrates
198
3
4.12 Summary
201
1
References
202
2
Chapter 5 Surface Mount Design Considerations
204
60
5.0 Introduction
204
1
5.1 System Design Considerations
205
2
5.2 Package Drivers
207
5
5.2.1 PGA Drivers
209
2
5.2.2 Fine Pitch Drivers
211
1
5.2.3 Ball Grid Array (BGA) Drivers
211
1
5.2.4 Issues in Component Packaging
211
1
5.3 Real Estate Considerations
212
2
5.4 Manufacturing Considerations
214
4
5.5 Cost Considerations
218
8
5.5.1 Printed Circuit Board Cost
218
6
5.5.2 Component Cost
224
1
5.5.3 Assembly Cost
225
1
5.6 Thermal Considerations
226
6
5.7 Package Reliability Considerations
232
18
5.7.1 Package Cracking Mechanism
234
10
5.7.2 Solutions to Package Cracking
244
4
5.7.3 Moisture Sensitivity Classification for Package Cracking
248
2
5.8 Solder Joint Reliability Considerations
250
7
5.8.1 Solder Joint Reliability Tests
253
4
5.9 Interconnect Considerations
257
3
5.10 CAD Layout Considerations
260
1
5.11 Summary
261
1
References
261
3
Chapter 6 Surface Mount Land Pattern Design
264
32
6.0 Introduction
264
2
6.1 General Considerations for Land Pattern Design
266
1
6.2 Land Patterns for Passive Components
266
6
6.2.1 Land Pattern Design for Rectangular Passive Components
269
1
6.2.2 Land Pattern Design for Tantalum Capacitors
270
2
6.3 Land Patterns for Cylindrical Passive (MELF) Devices
272
3
6.4 Land Patterns for Transistors
275
1
6.5 Land Patterns for Plastic Leaded Chip Carriers
275
6
6.6 Land Patterns for Leadless Ceramic Chip Carriers
281
2
6.7 Land Patterns for Small Outline Integrated Circuits and R-Packs
283
3
6.8 Land Patterns for SOJ (Memory) Packages
286
1
6.9 Land Patterns for DIP (Butt Mount) Packages
287
2
6.10 Land Patterns for Fine Pitch, Gull Wing Packages
289
2
6.11 Land Pattern Design for Ball Grid Arrays (BGAs)
291
2
6.12 Land Pattern Design for TAB
293
1
6.13 Land Patterns for Solder Paste and Solder Mask Screens
294
1
6.14 Summary
294
1
References
295
1
Chapter 7 Design for Manufacturability, Testing, and Repair
296
43
7.0 Introduction
296
1
7.1 DFM Organizational Structure
297
2
7.2 General Design Considerations
299
3
7.3 Component Selection Considerations for Manufacturability
302
3
7.4 Soldering Considerations
305
6
7.5 Component Orientation Considerations
311
5
7.6 Interpackage Spacing Considerations
316
6
7.6.1 Assumptions in Interpackage Spacing Requirements
317
1
7.6.2 Interpackage Spacing Requirements
318
4
7.7 Via Hole Considerations
322
4
7.8 Solder Mask Considerations
326
2
7.9 Repairability Considerations
328
2
7.10 Cleanliness Considerations
330
1
7.11 Testability Considerations
330
4
7.11.1 Guidelines for ATE Testing
331
3
7.12 Summary
334
1
References
335
4
PART THREE Manufacturing with Surface Mounting
339
386
Chapter 8 Adhesive and Its Application
339
44
8.0 Introduction
339
1
8.1 Ideal Adhesive for Surface Mounting
340
3
8.1.1 Precure Properties
340
1
8.1.2 Precure Properties
341
1
8.1.3 Postcure Properties
342
1
8.2 General Classification of Adhesives
343
1
8.3 Adhesives for Surface Mounting
344
2
8.3.1 Epoxy Adhesives
344
1
8.3.2 Acrylic Adhesives
345
1
8.3.3 Other Adhesives for Surface Mounting
346
1
8.4 Conductive Adhesives for Surface Mounting
346
4
8.4.1 Electrically Conductive Adhesives
346
3
8.4.1.1 Anisotropic Electrically Conductive Adhesive
348
1
8.4.2 Thermally Conductive Adhesive
349
1
8.5 Adhesive Application Methods
350
8
8.5.1 Stencil Printing
351
2
8.5.2 Pin Transfer
353
1
8.5.3 Syringing
353
5
8.6 Curing of Adhesives
358
11
8.6.1 Thermal Cure
358
9
8.6.1.1 Thermal Cure Profile and Bond Strength
359
3
8.6.1.2 Adhesive Cure Profile and Flux Entrapment
362
5
8.6.2 UV/Thermal Cure
367
2
8.7 Evaluation of Adhesives with Differential Scanning Calorimetry
369
12
8.7.1 Basic Principles of DSC Analysis
369
3
8.7.2 DSC Characterization of an Epoxy Adhesive
372
3
8.7.3 DSC Characterization of an Acrylic Adhesive
375
6
8.8 Summary
381
1
References
382
1
Chapter 9 Solder Paste and Its Application
383
61
9.0 Introduction
383
1
9.1 Solder Paste Properties
383
21
9.1.1 Metal Composition
385
3
9.1.2 Metal Content
388
1
9.1.3 Particle Size and Shape
388
3
9.1.4 Flux Activators and Wetting Action
391
2
9.1.5 Solvent and Void Formation
393
1
9.1.6 Rheological Properties
393
7
9.1.6.1 Viscosity
394
4
9.1.6.2 Slump
398
1
9.1.6.3 Working Life and Tackiness
399
1
9.1.7 Solder Balls
400
3
9.1.8 Printability
403
1
9.2 Solder Paste Printing Equipment
404
5
9.2.1 Selecting a Printer
405
4
9.3 Solder Paste Printing Processes
409
15
9.3.1 Paste Printer Setup
414
4
9.3.2 Screen Printing
418
1
9.3.3 Stencil Printing
419
2
9.3.4 Screen Printing versus Stencil Printing
421
2
9.3.5 Dispensing
423
1
9.4 Paste Printing Defects
424
2
9.5 Paste Printing Variables
426
10
9.5.1 Solder Paste Viscosity
426
1
9.5.2 Print Thickness and Snap-Off
427
1
9.5.3 Squeegee Wear, Pressure, Hardness, Type, and Orientation
428
2
9.5.4 Print Speed
430
1
9.5.5 Mesh/Stencil Tension
431
1
9.5.6 Board Warpage
431
1
9.5.7 Etched, Laser Cut, and Electroformed Stencils
431
5
9.5.7.1 Chemically Etched Stencils
432
2
9.5.7.2 Laser Cut Stencils
434
1
9.5.7.3 Electroformed Stencils
434
2
9.6 Printing for Different Types of Components
436
5
9.6.1 Printing for Ball Grid Arrays
437
1
9.6.2 Printing for Fine Pitch and Ultra Fine Pitch
437
1
9.6.3 Printing for Through Hole in a Mixed Assembly
438
3
9.7 Summary
441
1
References
442
2
Chapter 10 Metallurgy of Soldering and Solderability
444
49
10.0 Introduction
444
1
10.1 Phase Diagrams
445
6
10.2 Metallization Leaching in Passive Surface Mount Components
451
3
10.3 Solder Alloys and Their Properties
454
6
10.4 Lead-Free Solder
460
6
10.4.1 Lead Replacement Elements
460
2
10.4.2 Lead-Free Solders and Their Properties
462
4
10.5 Solderability
466
5
10.5.1 Wetting
467
2
10.5.2 Nonwetting
469
1
10.5.3 Dewetting
469
2
10.6 Various Approaches for Ensuring Solderability
471
2
10.7 Solderability Test Methods and Requirements
473
9
10.7.1 General Solderability Test Requirements
474
2
10.7.1.1 Steam Aging Requirements
474
2
10.7.1.2 Flux and Solder Requirements
476
1
10.7.2 Dip and Look Test
476
3
10.7.3 Wetting Balance Test
479
3
10.7.4 Globule Test
482
1
10.8 Effect of Substrate Surface Finish on Solderability
482
3
10.9 Effect of Component Lead or Termination Finish on Solderability
485
5
10.9.1 Effect of Ni-Pd Lead Finish on Solderability
488
2
10.10 Summary
490
1
References
490
3
Chapter 11 Component Placement
493
40
11.0 Introduction
493
1
11.1 Manual Placement of Parts
494
2
11.2 Automated Placement of Parts
496
1
11.3 Selection Criteria for Placement Equipment
497
17
11.3.1 Maximum Substrate Size Handling Capacity
500
1
11.3.2 Maximum Feeder Input or Slot Capacity
500
2
11.3.3 Types and Sizes of Components
502
1
11.3.4 Placement Rate and Flexibility
502
1
11.3.5 Placement Accuracy/Repeatability
503
2
11.3.6 Vision Capability
505
3
11.3.7 Adhesive Dispensing Capability
508
1
11.3.8 Equipment Software Program
508
3
11.3.9 Service, Support, and Training
511
1
11.3.10 Other Important Selection Criteria
512
2
11.4 Selection of Feeders for Placement Equipment
514
8
11.4.1 Tape and Reel Feeders
514
4
11.4.2 Bulk Feeders
518
1
11.4.3 Tube or Stick Feeders
519
2
11.4.4 Waffle Packs
521
1
11.5 Available Placement Equipment
522
9
11.5.1 Equipment with High Throughput
523
1
11.5.2 Equipment with High Flexibility
524
3
11.5.3 Equipment with High Flexibility and Throughput
527
4
11.5.4 Equipment with Low Cost and Throughput but High Flexibility
531
1
11.6 Summary
531
1
References
532
1
Chapter 12 Soldering of Surface Mounted Components
533
65
12.0 Introduction
533
2
12.1 Wave Soldering
535
7
12.1.1 Design and Process Variables in Wave Soldering
536
4
12.1.2 Process and Equipment Variables in Wave Soldering
540
2
12.2 Developing a Wave Solder Profile
542
2
12.3 Types of Wave Soldering for Surface Mounting
544
8
12.3.1 Dual-Wave Soldering
545
2
12.3.2 Vibrating Wave Soldering
547
2
12.3.3 Modified Wave Soldering
549
3
12.4 Wave Soldering in an Inert Environment
552
3
12.5 Single-Step Soldering of Mixed Assemblies
555
1
12.6 Single-Step Soldering of Double-Sided SMT Assemblies
556
2
12.7 Vapor Phase Soldering
558
9
12.7.1 The Heat Transfer Mechanism in Vapor Phase Soldering
561
3
12.7.2 Solder Opens (Wicking)
564
3
12.8 Infrared Reflow Soldering
567
8
12.8.1 Heat Transfer Mechanism in IR Dominant Systems
570
1
12.8.2 Heat Transfer Mechanism in Convection Dominant Systems
571
2
12.8.3 Heat Transfer Mechanism in Convection/IR Systems
573
1
12.8.4 Pros and Cons of Various IR Systems
573
2
12.9 IR Reflow Soldering in Nitrogen
575
1
12.10 Reflow Solder Profile Development
576
6
12.10.1 Preheat Zone
581
1
12.10.2 Soak Zone
581
1
12.10.3 Reflow Zone
581
1
12.10.4 Cooling Zone
582
1
12.11 Common Reflow Defects
582
2
12.11.1 Tombstoning and Part Movement
583
1
12.11.2 Thermal Shock on Components
583
1
12.11.3 Solder Mask Discoloration
584
1
12.12 Laser Reflow Soldering
584
4
12.13 Hot Bar Soldering
588
4
12.14 Hot Belt Reflow Soldering
592
1
12.15 Selecting the Appropriate Soldering Process and Equipment
593
2
12.16 Summary
595
1
References
595
3
Chapter 13 Flux and Cleaning
598
53
13.0 Introduction
598
1
13.1 Concerns in Surface Mount Cleaning
599
2
13.2 The Function of Flux
601
1
13.3 Considerations in Flux Selection
602
1
13.4 Flux Classification
603
9
13.4.1 Inorganic Fluxes
605
1
13.4.2 Organic Acid Fluxes
606
1
13.4.3 Rosin Fluxes
607
1
13.4.4 Low Residue or No-Clean Fluxes and Solder Pastes
608
4
13.4.4.1 Concerns About No-Clean Flux
610
2
13.5 Contaminants and Their Effects
612
3
13.5.1 Particulate Contaminants
612
1
13.5.2 Nonpolar Contaminants
613
1
13.5.3 Polar Contaminants
614
1
13.6 Major Considerations in the Selection of Cleaning Materials
615
6
13.6.1 Environmental Considerations
616
3
13.6.2 Other Considerations in Selecting Cleaning Materials
619
2
13.7 Cleaning Processes and Equipment
621
15
13.7.1 Organic Solvents (CFC Alternatives) and Cleaning Equipment
623
2
13.7.1.1 Batch Equipment for Organic Solvents
624
1
13.7.2 Semi-Aqueous Solvents and Cleaning Equipment
625
5
13.7.2.1 Semi-Aqueous Cleaning Equipment
626
4
13.7.3 Aqueous Cleaning Processes and Equipment
630
6
13.7.3.1 Deionization of Water for Cleaning
631
3
13.7.3.2 Aqueous Cleaning Equipment
634
2
13.8 Cleanliness Test Methods and Requirements
636
10
13.8.1 Visual Examination
636
1
13.8.2 Solvent Extraction
636
1
13.8.3 Surface Insulation Resistance (SIR)
637
9
13.8.3.1 SIR Measurement Test Conditions
639
3
13.8.3.2 Application of the SIR Test
642
4
13.9 Designing for Cleaning
646
2
13.10 Summary
648
1
References
649
2
Chapter 14 Quality Control, Inspection Repair, and Testing
651
74
14.0 Introduction
651
1
14.1 Statistical Quality Control
652
2
14.2 Application of SQC: A Case History
654
4
14.2.1 Implementing Statistical Process Control
657
1
14.3 Defects Related to Materials and Process
658
8
14.3.1 Substrate-Related Defects
659
1
14.3.2 Component-Related Defects
660
3
14.3.3 Adhesive-Related Defects
663
1
14.3.4 Defects Related to Solder Paste
664
1
14.3.5 Process-Related Defects
665
1
14.3.6 Design-Related Defects
665
1
14.4 Solder Joint Quality Requirements
666
15
14.4.1 Solder Joint Requirements for Rectangular Components
669
1
14.4.2 Solder Joint Requirements for Cylindrical Components
669
2
14.4.3 Solder Joint Requirements for Gull Wing Components
671
2
14.4.4 Solder Joint Requirements for J-Lead Components
673
1
14.4.5 Solder Joint Requirements for Butt Lead Components
673
1
14.4.6 Solder Joint Requirements for LCCCs
674
1
14.4.7 Generic Solder Joint Requirements
675
6
14.5 Solder Joint Inspection
681
9
14.5.1 Visual Inspection
681
2
14.5.2 Automated Inspection
683
7
14.5.2.1 Automated Laser Inspection
685
1
14.5.2.2 Transmission X-Ray and Scanned Beam Laminography Inspection
685
5
14.6 Repair Equipment and Processes
690
19
14.6.1 Repair Requirements
694
3
14.6.2 Soldering Irons for Surface Mount Repair
697
2
14.6.3 Hot Air Systems for Surface Mount Repair
699
2
14.6.4 BGA Repair
701
6
14.6.5 Rework Profiles
707
2
14.7 Assembly Testing
709
6
14.7.1 Fixtures for ATE Testing
711
3
14.7.2 Issues in ATE Testing
714
1
14.8 ISO 9000 Quality Standards and Certification
715
6
14.8.1 ISO 9000 Certification
716
2
14.8.2 Meeting ISO 9000 Standards
718
3
14.9 Summary
721
1
References
722
3
APPENDIX A SURFACE MOUNT STANDARDS
725
10
APPENDIX B DETAILED QUESTIONNAIRE FOR EVALUATING SMT EQUIPMENT: PICK-AND-PLACE (APPENDIX B1), SCREEN PRINTER (APPENDIX B2), AND REFLOW OVEN (APPENDIX B3)
735
12
APPENDIX C GLOSSARY
747
12
INDEX
759