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11th International Congress Molded Interconnect Devices - Scientific Proceedings: Selected, Peer Reviewed Papers from the 11th International Congress Molded Interconnect Devices (Mid 2014), September 24-25, 2014, Nuremberg / Fuerth,
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Paperback
Book cover for 9783038352525
 
from Trans Tech Pubn (November 30, 2014)
9783038352525 | details & prices | 124 pages | 6.75 × 9.25 × 0.25 in. | 0.90 lbs | List price $125.00