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semiconductors testing matches 8 work(s)
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Cover for 9780471511045 Cover for 9780134047478 Cover for 9780306443602 Cover for 9781489915245 Cover for 9780471241393 Cover for 9780471511045 Cover for 9780471739067 Cover for 9780471974017 Cover for 9780471492405 Cover for 9780750694728 Cover for 9780198564324
cover image for 9780134047478

Hardcover:

9780471511045, titled "Semiconductor Material and Device Characterization" | John Wiley & Sons Inc, June 1, 1990, cover price $99.95 | also contains Semiconductor Material and Device Characterization

Paperback:

9780134047478 | 5 pck pap/ edition (Prentice Hall, May 10, 2015), cover price $240.47

cover image for 9781489915245
Product Description: Although exploratory and developmental activity in electron beam testing (EBT) 25 years, it was not had already been in existence in research laboratories for over until the beginning of the 1980s that it was taken up seriously as a technique for integrated circuit (IC) testing...read more
By John T. L. Thong (editor)

Hardcover:

9780306443602 | Plenum Pub Corp, June 1, 1993, cover price $249.00 | About this edition: Although exploratory and developmental activity in electron beam testing (EBT) 25 years, it was not had already been in existence in research laboratories for over until the beginning of the 1980s that it was taken up seriously as a technique for integrated circuit (IC) testing.

Paperback:

9781489915245 | Reprint edition (Springer Verlag, June 4, 2013), cover price $249.00 | About this edition: Although exploratory and developmental activity in electron beam testing (EBT) 25 years, it was not had already been in existence in research laboratories for over until the beginning of the 1980s that it was taken up seriously as a technique for integrated circuit (IC) testing.

Semiconductor Material and Device Characterization is the only book on the market devoted to the characterization techniques used by the modern semiconductor industry to measure diverse semiconductor materials and devices. It covers the full range of electrical and optical characterization methods while thoroughly treating the more specialized chemical and physical techniques. This newly revamped and expanded Second Edition incorporates the many innovations that have come to dominate the field during the past decade. From scanning probe techniques to the detection of metallic impurities in silicon wafers to the use of microwave reflection to measure contactless resistivity, each chapter presents state-of-the-art tools and techniques, most of which were in their infancy or had not yet been developed when the previous edition first came out. Featured here are: * An entirely new chapter on reliability and probe microscopy * Numerous examples and end-of-chapter problems - new to this edition * Five hundred illustrations revised for this edition * Updated bibliography with over 1,200 references * Easy-to-use text including a real-world mix of units rather than strictly MKS units. This practical new edition is ideal for textbook adoptions at the graduate level and is destined to become an essential reference for research and development teams in the semiconductor industry.

Hardcover:

9780471739067 | 3 edition (IEEE, January 30, 2006), cover price $204.00
9780471241393 | 2 sub edition (Wiley-Interscience, May 1, 1998), cover price $132.00 | About this edition: Semiconductor Material and Device Characterization is the only book on the market devoted to the characterization techniques used by the modern semiconductor industry to measure diverse semiconductor materials and devices.
9780471511045 | John Wiley & Sons Inc, June 1, 1990, cover price $99.95 | also contains Horngren's Financial & Managerial Accounting + Myaccountinglab With Pearson Etext Access Card: The Managerial Chapters

Miscellaneous:

9780471749080 | 3 edition (Wiley-Interscience, February 10, 2006), cover price $160.00

Miscellaneous:

9780471749097 | 3 onl edition (John Wiley & Sons Inc, February 6, 2006), cover price $145.95

Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in the optimization of product quality. Integrated Circuit Failure Analysis describes state-of-the-art procedures for exposing suspected failure sites in semiconductor devices. The author adopts a hands-on problem-oriented approach, founded on many years of practical experience, complemented by the explanation of basic theoretical principles. Features include: Advanced methods in device preparation and technical procedures for package inspection and semiconductor reliability. Illustration of chip isolation and step-by-step delayering of chips by wet chemical and modern plasma dry etching techniques. Particular analysis of bipolar and MOS circuits, although techniques are equally relevant to other semiconductors. Advice on the choice of suitable laboratory equipment. Numerous photographs and drawings providing guidance for checking results. Focusing on modern techniques, this practical text will enable both academic and industrial researchers and IC designers to expand the range of analytical and preparative methods at their disposal and to adapt to the needs of new technologies.

Hardcover:

9780471974017 | John Wiley & Sons Inc, March 1, 1998, cover price $266.00 | About this edition: Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in the optimization of product quality.

Miscellaneous:

9780470859520 | John Wiley & Sons Inc, December 6, 2000, cover price $225.00

cover image for 9780471492405
Product Description: Fault detection has become increasingly difficult as integrated circuits become more and more complex. Photon Emission Microscopy (PEM) is a physical failure analysis technique which locates and identifies faults in integrated circuits. (view table of contents, read Amazon.com's description)

Hardcover:

9780471492405 | John Wiley & Sons Inc, January 9, 2001, cover price $277.00 | About this edition: Fault detection has become increasingly difficult as integrated circuits become more and more complex.

cover image for 9780198564324
Product Description: Microscopy is central to the vast majority of semiconductor failure analyses, and is therefore of great importance to engineers concerned with design validation, process optimization, component qualification, testing, and pre- or post-use diagnostics...read more

Paperback:

9780198564324 | Gordon & Breach Science Pub, August 1, 1992, cover price $29.95 | About this edition: Microscopy is central to the vast majority of semiconductor failure analyses, and is therefore of great importance to engineers concerned with design validation, process optimization, component qualification, testing, and pre- or post-use diagnostics.

Hardcover:

9780936659602 | Optical Society of Amer, February 1, 1987, cover price $62.00

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