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Product Description: Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation...read more

Hardcover:

9781608076970 | Artech House, December 31, 2013, cover price $164.00 | About this edition: Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation.

displaying 1 to 2 | at end