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Tai-Ran Hsu has written 5 work(s)
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Cover for 9780046200138 Cover for 9789401160001 Cover for 9780470083017 Cover for 9780863413353 Cover for 9780072393910 Cover for 9780314807816 Cover for 9780534938246
cover image for 9789401160001

Hardcover:

9780046200138 | Unwin Hyman, November 1, 1986, cover price $59.50

Paperback:

9789401160001 | Springer Verlag, February 12, 2012, cover price $99.00

cover image for 9780863413353
Product Description: MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and mircrosystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered...read more

Hardcover:

9780863413353 | Inspec/Iee, December 1, 2003, cover price $131.00 | About this edition: MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS).

cover image for 9780072393910
Product Description: Microsystems and MEMS technology represents one of the biggest breakthroughs in the area of mechanical and electronic technology to occur in recent years. This is the technology of extremely small and powerful devices – and systems built around such devices – which have mechanical and electrical components...read more (view table of contents, read Amazon.com's description)

Hardcover:

9780072393910 | McGraw-Hill College, October 1, 2001, cover price $161.90 | About this edition: Microsystems and MEMS technology represents one of the biggest breakthroughs in the area of mechanical and electronic technology to occur in recent years.

Hardcover:

9780534938246 | Pws Pub Co, August 1, 1991, cover price $115.95
9780314807816 | West Group, August 1, 1991, cover price $60.75

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