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Tai-Ran Hsu has written 5 work(s)
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Hardcover:
9780046200138 | Unwin Hyman, November 1, 1986, cover price $59.50
Paperback:
9789401160001 | Springer Verlag, February 12, 2012, cover price $99.00
Hardcover:
9780470083017 | 2 edition (John Wiley & Sons Inc, March 14, 2008), cover price $160.00
Product Description: MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and mircrosystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered...read more
Hardcover:
9780863413353 | Inspec/Iee, December 1, 2003, cover price $131.00 | About this edition: MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS).
Product Description: Microsystems and MEMS technology represents one of the biggest breakthroughs in the area of mechanical and electronic technology to occur in recent years. This is the technology of extremely small and powerful devices â and systems built around such devices â which have mechanical and electrical components...read more (view table of contents, read Amazon.com's description)
Hardcover:
9780072393910 | McGraw-Hill College, October 1, 2001, cover price $161.90 | About this edition: Microsystems and MEMS technology represents one of the biggest breakthroughs in the area of mechanical and electronic technology to occur in recent years.
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Hardcover:
9780534938246 | Pws Pub Co, August 1, 1991, cover price $115.95
9780314807816 | West Group, August 1, 1991, cover price $60.75
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